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> if you ever want to run the machine hard long-term, you can use 1mm thermal pads between the heatsink and bottom of external case (and then it'll never throttle).

That will spread the heat to the battery and degrade it much faster.



The inverse is true:

This removes heat from the internal compartments (which logic board heat sink and battery co-habitate [0]) by transferring it outside via heat conduction through the case. There is no detectible heat increase (to touch) — consider the heat masses relative sizes (processor v. entire metal case).

[0] See <https://www.youtube.com/watch?v=jXY9tCBpf48&t=188> — thermal pad placement goes between four central screws (above processor)

As a thought experiment: how would ejecting heat from the inside increase its temperature?




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